„Interconnection“

Suchergebnisse

1.000+ Treffer

• A methodology to enable automatic 3D routing of aircraft Electrical Wiring Interconnection System
  Zhu, Z. ; La Rocca, G. ; van Tooren, M. J. L.
• Network externalities and interconnection incentives
  Vanberg, Margit A. 2005 Zentrum für Europ. Wirtschaftsforschung
• Assessment of interconnection between surface water and groundwater in Sawa Lake area, southern Iraq, using stable isotope technique
  Ali, K. K. ; Ajeena, A. R.
• Loss Analysis of P3 Laser Patterning of Perovskite Solar Cells via Hyperspectral Photoluminescence Imaging
  Schultz, Christof ; Fenske, Markus ; Otto, Nicolas ; Dion-Bertrand, Laura-Isabelle ; Gélinas, Guillaume ; Marcet, Stéphane ; Dagar, Janardan ; Schlatmann, Rutger ; Unger, Eva ; Stegemann, Bert ; Bouclé, Johann 2025 Hochschule für Technik und Wirtschaft Berlin
• Set-up reduction in an interconnection axle manufacturing cell using SMED
  Morales Méndez, Jonathan David ; Silva Rodríguez, Ramón
• Stomach Cancer: Interconnection between the Redox State, Activity of MMP-2, MMP-9 and Stage of Tumor Growth
  Burlaka, Anatoly P. ; Ganusevich, Irina I. ; Gafurov, Marat R. ; Lukin, Sergey M. ; Sidorik, Evgeny P.
• Functional interconnections of HY1 with MYC2 and HY5 in Arabidopsis seedling development
  Prasad, Babu Rajendra V. ; Kumar, Selva V. ; Nandi, Ashis ; Chattopadhyay, Sudip
• Increased Light Harvesting by Structured Cell Interconnection Ribbons: An Optical Ray Tracing Study Using a Realistic Daylight Model
  Holst, Hendrik ; Schulte-Huxel, Henning ; Winter, Matthias ; Blankemeyer, Susanne ; Witteck, Robert ; Vogt, Malte R. ; Booz, Thomas ; Distelrath, Fabian ; Köntges, Marc ; Bothe, Karsten ; Brendel, Rolf 2016 Gottfried Wilhelm Leibniz Universität Hannover
• A Gradient Stiffness‐Programmed Circuit Board by Spatially Controlled Phase‐Transition of Supercooled Hydrogel for Stretchable Electronics Integration (Adv. Mater. 25/2024)
  Kim, Minwoo ; Hong, Sangwoo ; Park, Jung Jae ; Jung, Yeongju ; Choi, Seok Hwan ; Cho, Chulmin ; Ha, Inho ; Won, Phillip ; Majidi, Carmel ; Ko, Seung Hwan
• A Reversible, Versatile Skin‐Attached Haptic Interface Platform with Bioinspired Interconnection Architectures Capable of Resisting Sweat and Vibration (Adv. Funct. Mater. 17/2024)
  Kim, Jinhyung ; Hwang, Gui Won ; Song, Minwoo ; Lim, Dohyun ; Kim, Jae‐Ik ; Choi, Jin‐Ho ; Lee, Yeon Soo ; Kim, Da Wan ; Yang, Tae‐Heon ; Pang, Changhyun
• Memory Devices: Simultaneous Roll Transfer and Interconnection of Flexible Silicon NAND Flash Memory (Adv. Mater. 38/2016)
  Kim, Do Hyun ; Yoo, Hyeon Gyun ; Hong, Sung Min ; Jang, Bongkyun ; Park, Dae Yong ; Joe, Daniel J. ; Kim, Jae‐Hyun ; Lee, Keon Jae
• Correction to: “Interrogating “privacy” in a world brimming with high political entanglements, surveillance, interdependence & interconnections” (EDITORIAL CHAPTER)
  Mathews, Robert
• Multi-regulatory network of ROS: the interconnection of ROS, PGC-1 alpha, and AMPK-SIRT1 during exercise
  Thirupathi, Anand ; Souza, Claudio Teodoro de
• Fault-Tolerance Mechanisms in the SB-PRAM Multiprocessor
  Braun, Michael ; Grävinghoff, Andreas ; Keller, Jörg 2017 FernUniversität in Hagen
• Fabrication of Thermoresponsive and Multimaterial Hydrogel Sheets by Spatially Controlled Aspiration and Interconnection of Microgel Building Blocks (Adv. Mater. Technol. 23/2023)
  Weigel, Niclas ; Grigoryev, Evgeny ; Fertala, Nicole ; Thiele, Julian
• Cover Picture: Fabrication and Electrical and Mechanical Properties of Carbon Nanotube Interconnections (Adv. Funct. Mater. 11/2005)
  Wang, M. S. ; Wang, J. Y. ; Chen, Q. ; Peng, L.‐M.
• Nanoscale Dewetting: Nanoscale‐Dewetting‐Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing (Adv. Mater. 21/2020)
  Lee, Ju Seung ; Kang, Seung Ji ; Shin, Joo Hwan ; Shin, Yiel Jae ; Lee, Byunghoon ; Koo, Ja‐Myeong ; Kim, Tae‐il
• Solution Phase and Nanoparticular Biosynthetically Inspired Interconnections in the Canthin‐6‐one β‐Carboline Series and Study of Phenotypic Properties on C. elegans (Eur. J. Org. Chem. 26/2013)
  Cebrián‐Torrejón, Gerardo ; Mackiewicz, Nicolas ; Vázquez‐Manrique, Rafael P. ; Fournet, Alain ; Figadère, Bruno ; Nicolas, Julien ; Poupon, Erwan
• DIN EN IEC 61189-2-808, Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen. Teil 2-808, Thermischer Widerstand der dielektrischen Schicht durch thermische transiente Methode (IEC 61189-2-808:2024) – = Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 2-808, Thermal resistance of an assembly by thermal transient method (IEC 61189-2-808:2024)
  2025 DIN Media GmbH
• DIN EN IEC 61189-2-805, Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen. Teil 2-805, X/Y CTE Prüfung für dünne Basismaterialien von TMA (IEC 61189-2-805:2024) – = Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 2-805, X/Y CTE test for thin base materials by TMA (IEC 61189-2-805:2024)
  2025 DIN Media GmbH