„Electronic Packaging“

Suchergebnisse

1.000+ Treffer

• Printed electronics for smart packaging
  Wu, Wei 2026 WILEY VCH
• Broadband Photodetectors and Imagers in Stretchable Electronics Packaging (Adv. Mater. 20/2024)
  Araki, Teppei ; Li, Kou ; Suzuki, Daichi ; Abe, Takaaki ; Kawabata, Rei ; Uemura, Takafumi ; Izumi, Shintaro ; Tsuruta, Shuichi ; Terasaki, Nao ; Kawano, Yukio ; Sekitani, Tsuyoshi
• Memory Devices: Simultaneous Roll Transfer and Interconnection of Flexible Silicon NAND Flash Memory (Adv. Mater. 38/2016)
  Kim, Do Hyun ; Yoo, Hyeon Gyun ; Hong, Sung Min ; Jang, Bongkyun ; Park, Dae Yong ; Joe, Daniel J. ; Kim, Jae‐Hyun ; Lee, Keon Jae
• Microstructured BN Composites with Internally Designed High Thermal Conductivity Paths for 3D Electronic Packaging (Adv. Mater. 38/2022)
  He, Hongying ; Peng, Weixiang ; Liu, Junbo ; Chan, Xin Ying ; Liu, Shike ; Lu, Li ; Le Ferrand, Hortense
• Flexible Electronics: Soft Material‐Enabled, Active Wireless, Thin‐Film Bioelectronics for Quantitative Diagnostics of Cervical Dystonia (Adv. Mater. Technol. 10/2019)
  Kwon, Young‐Tae ; Lee, Yongkuk ; Berkmen, Gamze Kilic ; Lim, Hyo‐Ryoung ; Scorr, Laura ; Jinnah, Hyder A. ; Yeo, Woon‐Hong
• Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review (Adv. Mater. 52/2022)
  Wen, Yingfeng ; Chen, Chao ; Ye, Yunsheng ; Xue, Zhigang ; Liu, Hongyuan ; Zhou, Xingping ; Zhang, Yun ; Li, Dequn ; Xie, Xiaolin ; Mai, Yiu‐Wing
• Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements
  Stein, Stefan ; Schmidt, Michael ; Drossel, Welf-Guntram ; Franke, Jörg ; Hanenkamp, Nico ; Hausotte, Tino ; Merklein, Marion ; Wartzack, Sandro 2022 FAU University Press
• Introduction to Microelectronics Advanced Packaging Assurance
  Asadizanjani, Navid ; Reddy Kottur , Himanandhan ; Dalir, Hamed 2025 Springer Nature Switzerland, Imprint: Springer
• Printed Electronics for Smart Packaging
  Wu, Wei 2025 Wiley-VCH
• Silicon Semiconductor Technology – Processing and Integration of Microelectronic Devices
  Hilleringmann, Ulrich 2023 Springer Fachmedien Wiesbaden
• Design, Test, Integration and Packaging of MEMS/MOEMS, 2004
  Michel, Bernd
• Design, test, integration and packaging of MEMS/MOEMS, 2006
  Michel, B. ; Courtois, B.
• Special issue on Design, Test, Integration and Packaging of MEMS and MOEMS, 2016
  Nouet, Pascal ; Michel, Bernd
• Special issue on Design, Test, Integration and Packaging of MEMS and MOEMS (DTIP 2015), held in Montpellier, France, April 27–30, 2015
  Nouet, Pascal ; Michel, Bernd
• High-performance Cu–Cu interconnects attained through air sintering of oleylamine-capped Cu nanoparticles for power electronics packaging
  Xia, Shi-Yu ; Li, Xiang-Ji ; Guo, Ying-Jie ; Yuan, Jun-Jie ; Sun, Zhe-Fei ; Cao, Hui-Jun ; Zhang, Shu-Ye ; Cai, Wen-Zhi ; Li, Jin-Tang ; Zhang, Zhi-Hao
• Printed Electronics for Smart Packaging
  Wu, Wei 2025 Wiley-VCH
• Theoretical and experimental studies of spring-buffer chip peeling technology for electronics packaging
  Hong, Jinhua ; Chen, Wei ; Guo, Jinhong ; Cheng, Peng ; Li, Yulong ; Dong, Wentao
• Surface mount technologies, technologies, circuits & tools, hybrid & advanced packaging technologies – Tagungsband
  Eder, Alfred 1995 VDE-Verl.
• Development of inline cure characterization methods of epoxy-based packaging materials for electronic packages via dielectric analysis
  Franieck Dalferth, Erick ; Schneider-Ramelow, Martin ; Kandelbauer, Andreas ; Auhl, Dietmar 2023 Technische Universität Berlin
• Reliability analysis of foil substrate based integration of silicon chips
  Palavesam, Nagarajan ; Bock, Karlheinz ; Svasta, Paul 2020 Technische Universität Dresden