„Microstructure evolution“

Suchergebnisse

2.774 Treffer

• Evaluation the Impact of Annealing on Phase Evolution, Microstructure, and Magnetic Properties of Nanocrystalline Ball-Milled LiSm Ferrite
  Mahmoudi, M. ; Kavanlouei, M. ; Maleki-Ghaleh, H.
• Interfacial Microstructure Evolution Between Sn-Zn Solders and Ag Substrate During Solid-State Annealing
  Wang, Chao-hong ; Li, Po-yi ; Li, Kuan-ting
• Microstructure and Sn Crystal Orientation Evolution in Sn-3.5Ag Lead-Free Solders in High-Temperature Packaging Applications
  Zhou, Bite ; Muralidharan, Govindarajan ; Kurumadalli, Kanth ; Parish, Chad M. ; Leslie, Scott ; Bieler, Thomas R.
• The Effect of Furnace Temperature on Evolution of the Microstructure of Type-VIII Clathrate Ba8Ga16Sn30 Polycrystals Grown from Ba8Ga16Sn50 Solutions
  Hong, Qin-Gang ; Chang, Li-Shin ; Hsieh, Huey-Lin
• Microstructure Evolution of Cu-Cored Sn Solder Joints Under High Temperature and High Current Density
  Sa, Xianzhang ; Wu, Ping
• Characterization of Recrystallization and Microstructure Evolution in Lead-Free Solder Joints Using EBSD and 3D-XRD
  Zhou, Bite ; Bieler, Thomas R. ; Lee, Tae-Kyu ; Liu, Wenjun
• Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation
  Lee, Tae-Kyu ; Zhou, Bite ; Bieler, Thomas ; Liu, Kuo-Chuan
• Effects of Annealing on Phase Evolution, Microstructure, and Magnetic Properties of Nanocrystalline Ball-Milled LiZnTi Ferrite
  Kavanlooee, M. ; Hashemi, B. ; Maleki-Ghaleh, H. ; Kavanlooee, J.
• A Study on Sputtered Bi-Te Thermoelectric Films with Various Compositions: Microstructure Evolution and the Effects on Thermoelectric and Electrical Properties
  Oh, Minsub ; Jeon, Seong-jae ; Jeon, Haseok ; Hyun, Seungmin ; Lee, Hoo-jeong
• Effect of Prebonding Anneal on the Microstructure Evolution and Cu–Cu Diffusion Bonding Quality for Three-Dimensional Integration
  Peng, L. ; Lim, D.F ; Zhang, L. ; Li, H.Y ; Tan, C.S
• Solder Volume Effects on the Microstructure Evolution and Shear Fracture Behavior of Ball Grid Array Structure Sn-3.0Ag-0.5Cu Solder Interconnects
  Li, X. P. ; Xia, J. M. ; Zhou, M. B. ; Ma, X. ; Zhang, X. P.
• Evolution of the AgCdO Contact Material Surface Microstructure with the Number of Arcs
  Pons, Frédéric ; Cherkaoui, Mohammed ; Ilali, Idriss ; Dominiak, Serge
• Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy
  Lee, Tae-Kyu ; Zhou, Bite ; Blair, Lauren ; Liu, Kuo-Chuan ; Bieler, Thomas R.
• Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging
  Hao, Hu ; Shi, Yaowu ; Xia, Zhidong ; Lei, Yongping ; Guo, Fu
• A Preliminary Electron Backscatter Diffraction Study of Microstructures and Microtextures Evolution during Au Stud and Flip Chip Thermosonic Bonding
  Li, Chun-Mei ; Yang, Ping ; Liu, De-Ming ; Hung, Ngar-Chun ; Li, Ming
• Microstructure and mechanical properties evolution of intermetallics between Cu and Sn-3.5Ag solder doped by Ni-Co additives
  Gao, F. ; Takemoto, T. ; Nishikawa, H. ; Komatsu, A.
• Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates
  Tsai, J. Y. ; Chang, C. W. ; Ho, C. E. ; Lin, Y. L. ; Kao, C. R.
• Microstructure and shear strength evolution of Sn-Ag-Cu solder bumps during aging at different temperatures
  Li, Dezhi ; Liu, Changqing ; Conway, Paul P.
• Three-dimensional simulation of microstructure evolution in damascene interconnects: Effect of overburden thickness
  Jung, Jung-Kyu ; Hwang, Nong-Moon ; Park, Young-Joon ; Joo, Young-Chang
• Temperature and duration effects on microstructure evolution during copper wafer bonding
  Chen, K. N. ; Fan, A. ; Tan, C. S. ; Reif, R.